(c)
Record the following information for all defective components:
1 Menu number.
2 Assembler's lot number.
3 Component nomenclature and code (Table M) (Table 3-13).
4 Processor's and/or plant name (if available).
5 Defect number (Tables F and G) (Tables 3-6 and 3-7).
6 Specific defect code (if applicable) (Table K) (Table 3-11).
7 Narrative description of defect (if necessary).
8 Tally defects (Major A, Major B, Minor) according to the type of
component.
(5) All components observed during the inspection with Major A or Major B
defects will be discarded (whether they are part of the sample or not). Components not
exhibiting defects or those exhibiting only minor defects may be reassembled into the
lot.
(6) Component packages with a Major A or Major B packaging defect
should be opened to evaluate the effect the defect has on the product. Any findings
should be recorded as a note on the inspection record.
NOTE:
This inspection should in no way be confused with the normal open package
inspection. Open package inspection is a phase of inspection during which
only those components that did not show any external Major A or Major B
packaging defects are examined.
f. STEP 6: Perform Destructive Open Package Inspection
(1) Open package inspection will be performed in accordance with Table H,
Sampling Criteria for Destructive Open Package Inspection (DOPI) (Normal Inspection)
(Table 3-8) and those defects listed in Table J, Destructive Open Package Inspection
(Table 3-10).
(2) If a menu bag has already had a defect scored against it prior to this
point, it cannot be used for DOPI. A new sample menu must be drawn to replace any
menu bags with previous defects, and these will be utilized for DOPI only.
(3) Refer to the component monographs (figure 3-1) for information relative
to the product's normal characteristics, the most likely deteriorative conditions to be
observed and any unique inspection information and special notes concerning the item.
MD0718
3-6