d. STEP 4: Perform Closed Package Inspection of Module Contents.
(1) Perform closed package inspection (CPI) of module contents In
accordance with Table C, Sample Criteria For Normal Inspection of Module Contents
(Table 4-3) select the appropriate number of modules being sure the samples are
proportionally representative of the modules in the lot.
Open the sample modules.
(3) Module components will be inspected for defects in accordance with
tables; Table F, Defects for Metal Trays (Table 4-6), Table G, Defects for Metal
Containers Other Than Trays (Table 4-7), Table H, Defects for Plastic/Glass Containers
(Table 4-8), Table I, Defects for Flexible Pouches (Table 4-9), Table J, Defects for
Envelopes (Packets) (Table 4-10), and Table K, Defects for Nonfood Components
(4) Thoroughly examine all components within the module under a good
light source and, if available, with the aid of a magnification lens. When a component
exhibits more than one defect, it will be classified by the most serious defect it
possesses. Record the following information for all defective components:
(a) Menu number
Assembler's lot number
Component nomenclature and code
Processor's and/or plant name (if available)
Specific defect code (if applicable)
Narrative description of defect (if necessary)
(h) Tally defects (Major A, Major B, Minor) according to type of
e. STEP 5: Perform Destructive Open Package Inspection.
(1) Perform destructive open package inspection (DOPI) in accordance with
Table C, Sample Criteria for Normal Inspection of Module Contents (Table 4-3) select
the appropriate number of modules being sure the samples are proportionally
representative of the modules in the lot.
Open the sample module(s).