(3) Module components will be inspected for defects in accordance with
Table L, DOPI Defects (Table 4-12).
(4) Thoroughly examine all items within the module under a good light
source and, if available, with the aid of a magnification lens. When a component
exhibits more than one defect, it will be classified by the most serious defect it
possesses. However, for the purpose of gathering additional information, the lesser
defects will also be noted. Record the following information for all defective
(a) Menu number.
Assembler's lot number.
Component nomenclature and code.
Processor's and/or plant name (if available).
(e) Defect number (Tables F-L) (Tables 4-6 4-12).
Specific defect code (Table M) (Table 4-13).
Narrative description of defect (if necessary).
(h) Tally defects (Major A, Major B, Minor) according to type of
(5) Component packages with a Major A or Major B packaging defect
should be opened to evaluate the effect the defect has on the product. Any findings
should be recorded as a note on the inspection record.
(6) Inspectors should refer to the component monographs (figure 4-1) for
information relative to the product's normal characteristics, the most likely deteriorative
conditions to be observed and any unique inspection information and special notes
concerning the item. Monographs can be accessed on the Defense Supply Center
(7) Each component of the sample modules (including all accessory items)
will be opened and inspected. If no Major A or Major B defects are noted and the action
number for minor defects is not reached or exceeded during normal open package
inspection, this phase of the inspection should be considered complete.
Classify each defective by the most serious defect it possesses.